1.Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen 5185055, China; 2.Shenzhen Key Laboratory of Smart Sensing and Intelligent Systems, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China; 3.School of Aeronautics and Astronautics, Sun Yatsen University, Shenzhen 518107, China; 4.Ultrasonic Instrument Branch, Guangdong Goworld Co., Ltd., Shantou 515041, China; 5.School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510641, China; 6.Guangdong Provincial Key Laboratory of Robotics and Intelligent System, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
TH17
