Meniscus-confined electrodeposition (MCED) technology has gained considerable attention in micro/nanoscale structure fabrication due to its low cost and high precision. However, the limited displacement range of piezoelectric stages restricts its applicability in large-scale manufacturing scenarios. To overcome this limitation, a cross-scale continuous deposition method based on visual inspection is proposed. This approach integrates a microscope camera and a threeaxis motion system into existing MCED equipment, creating a cross-scale continuous deposition platform that combines coarse probe adjustments with fine platform positioning, guided by microscopic vision measurements. Next, by using predefined equidistant displacements of the micro/nano platform as a reference, pixel shifts corresponding to these displacements are calculated through image grayscale analysis. This data is then used to develop an Adam-optimized gradient descent model, which establishes an “object-to-image” distance mapping relationship, enabling high-precision positioning and measurement of the deposited material and the probe from a single camera image. Visual feedback control is employed to achieve precise alignment and deposition positioning, facilitating cross-scale continuous deposition on the MCED platform. Finally, a confocal microscope is used to measure and analyze the length and junction quality of the deposits. The results demonstrate that this method enables the deposition of millimeter-scale line segments using an 80 μm-range piezoelectric stage, with deposition length errors below 3% , while maintaining high quality and precision at the segment endpoints. This approach offers a promising solution for large-scale precision manufacturing.